SiliconHQ produces high purity germanium sputtering targets with the highest possible density and smallest average grain sizes for use in semiconductor displays, chemical vapor deposition (CVD) and optical applications, and physical vapor deposition (PVD).
Our standard thin-film sputtering targets are available in monoblock or bonded designs with target dimensions and flat configurations up to 820mm with tapping, chamfering, slotting, and hole drilling sites and backings compatible with both legacy and newer sputtering equipment such as large-area Coatings for solar power or fuel cell and flip-chip applications.
Research size targets, as well as custom sizes and alloys, are also manufactured. ICP).”Spraying” allows for the deposition of a thin film of an ultra-high purity powdered metal or oxide material onto another solid substrate by controlled removal and conversion of the target material to a targeted gas/plasma phase by sputtering.
The materials are made by crystallization, solid-state, and other ultra-high purification processes such as sublimation.
Germanium (Ge (N-Type)) General Information
Germanium is a hard, brittle material with an off-white, semi-metallic appearance. It has a density of 5.35 g/cc, a melting point of 937°C, and vapor pressure of 104 Torr at 1167°. C. It is classified as a semimetal on the periodic table, meaning it has properties of both metals and nonmetals. Like silicon, germanium is a semiconductor and is commonly used to manufacture transistors and integrated circuits. For example, the manufacture of optical storage media and optical coatings is often vacuum evaporated to create layers. Other uses of the material are as an alloying agent and catalyst.